ACA Curing Process Optimization Based on Curing Degree Considering Shear Strength of Joints
This paper presents an optimized curing process for the shear strength achievement and retention for anisotropic conductive adhesive (ACA) flip-chip interconnections.The curing kinetics of ACA is first presented and Acrylic Board Wall Art then a curing degree (α) relationship between curing temperature T and curing time t is established.The